IP Library › Assignment 038820/0399
Patent Assignment
Reel/Frame 038820/0399

Assignment of Assignor's Interest

Recorded: 2016-06-06 Pages: 3
Assignor
HSIEH, YU-TE
Executed: 2016-04-19
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
High Reliability Wafer Level Semiconductor Packaging
Patent: 9,859,180 →
Application: 15/174,450 →
Publication: US 2017/0236761
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →