Patent Assignment
Reel/Frame 038845/0372
Assignment of Assignor's Interest
Recorded: 2016-06-08
Pages: 3
Assignor
SANDISK 3D LLC
Executed: 2016-06-07
Assignee
SANDISK TECHNOLOGIES LLC
6900 DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Property
(1)
Metal Structures for Integrated Circuits and Methods for Making the Same
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest
Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement
Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047196 Frame: 0097. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →