Patent Assignment
Reel/Frame 038883/0180
Assignment of Assignor's Interest
Recorded: 2016-06-03
Pages: 5
Assignors
BANG, WON BAE
Executed: 2016-04-19
KIM, BYONG JIN
Executed: 2016-05-09
KIM, GI JEONG
Executed: 2016-05-10
KWON, JAE DOO
Executed: 2016-06-02
JEON, HYUNG IL
Executed: 2016-05-09
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Having Routable Encapsulated Conductive Substrate and Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.