Patent Assignment
Reel/Frame 038924/0721
Assignment of Assignor's Interest
Recorded: 2016-06-15
Pages: 3
Assignee
FCI AMERICAS TECHNOLOGY, INC.
ONE EAST FIRST STREET, RENO, NEVADA, 89501
Covered Property
(1)
Interconnect for Electrically Connecting a Multichip Module to a Circuit Substrate and Processes for Making and Using Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 5, 2014
From: SANMINA CORPORATION, AS GRANTOR; SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR; HADCO SANTA CLARA, INC., AS GRANTOR; SCI TECHNOLOGY, INC., AS GRANTOR
To: US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 033094/0826 →
Assignment of Assignor's Interest
Sep 16, 2016
From: FCI AMERICAS TECHNOLOGY, INC.
To: SANMINA-SCI CORPORATION
Reel/Frame 040066/0271 →
Merger
May 18, 2017
From: SANMINA-SCI CORPORATION
To: SANMINA CORPORATION
Reel/Frame 042431/0916 →
Release of Security Interest
Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →