Patent Assignment
Reel/Frame 040066/0271
Assignment of Assignor's Interest
Recorded: 2016-09-16
Pages: 2
Assignor
FCI AMERICAS TECHNOLOGY, INC.
Executed: 2003-10-07
Assignee
SANMINA-SCI CORPORATION
2700 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Interconnect for Electrically Connecting a Multichip Module to a Circuit Substrate and Processes for Making and Using Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 5, 2014
From: SANMINA CORPORATION, AS GRANTOR; SANMINA CORPORATION, F/K/A SANMINA-SCI CORPORATION, AS GRANTOR; HADCO SANTA CLARA, INC., AS GRANTOR; SCI TECHNOLOGY, INC., AS GRANTOR
To: US BANK NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 033094/0826 →
Assignment of Assignor's Interest
Jun 15, 2016
From: ADAMS, CHRISTOPHER SCOTT; BEARDSLEY, SCOTT BRIAN
To: FCI AMERICAS TECHNOLOGY, INC.
Reel/Frame 038924/0721 →
Merger
May 18, 2017
From: SANMINA-SCI CORPORATION
To: SANMINA CORPORATION
Reel/Frame 042431/0916 →
Release of Security Interest
Jun 5, 2019
From: U.S. BANK NATIONAL ASSOCIATION, SOLELY AS NOTES COLLATERAL AGENT
To: SANMINA CORPORATION; HADCO CORPORATION; HADCO SANTA CLARA; SCI TECHNOLOGY
Reel/Frame 049378/0927 →