IP Library › Assignment 039003/0505
Patent Assignment
Reel/Frame 039003/0505

Assignment of Assignor's Interest

Recorded: 2016-06-24 Pages: 4
Assignors
LEE, WON-JUN
Executed: 2016-06-21
PARK, JAE-MIN
Executed: 2016-06-21
Assignee
UP CHEMICAL CO., LTD.
(CHILGOE-DONG), 81, SANDAN-RO 197BEON-GIL, PYEONGTAEK-SI, GYEONGGI-DO, 17749, KOREA, REPUBLIC OF
Covered Property (1)
Copper Metal Film, Method for Preparing the Same, and Method for Forming Copper Interconnect for Semiconductor Device Using the Same
Application: 15/191,848 →
Publication: US 2016/0305024
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
License Apr 21, 2022
From: UP CHEMICAL CO., LTD.
To: JIANGSU SHEKOY SEMICONDUCTOR NEW MATERIAL CO., LTD.
Reel/Frame 059671/0175 →