Patent Assignment
Reel/Frame 039021/0411
Assignment of Assignor's Interest
Recorded: 2016-06-27
Pages: 4
Assignors
SHAO, TUNG-LIANG
Executed: 2016-06-16
HSIAO, YI-LI
Executed: 2016-06-16
CHEN, HSIAO-YUN
Executed: 2016-06-16
TUNG, CHIH-HANG
Executed: 2016-06-16
YU, CHEN-HUA
Executed: 2016-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Immersion Interconnections for Semiconductor Devices and Methods of Manufacture Thereof