Patent Assignment
Reel/Frame 039047/0446
Assignment of Assignor's Interest
Recorded: 2016-06-29
Pages: 5
Assignors
OH, CHEOW KHOON
Executed: 2016-06-28
LU, MING-CHEN
Executed: 2016-06-28
SUI, XIAOMING
Executed: 2016-06-28
CHEN, BO
Executed: 2016-06-28
XUE, VINCENT
Executed: 2016-06-28
Assignee
ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Wafer Level Chip Scale Package Structure and Manufacturing Method Thereof