Patent Assignment
Reel/Frame 039071/0046
Assignment of Assignor's Interest
Recorded: 2016-07-05
Pages: 12
Assignors
HSU, LI-CHIEH
Executed: 2016-07-01
TSAI, FU-SHOU
Executed: 2016-07-01
LI, YU-TING
Executed: 2016-07-01
LIU, YI-LIANG
Executed: 2016-07-01
LI, KUN-JU
Executed: 2016-07-01
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Planarizing Substrate Surface
Patent:
9,773,682 →
Application:
15/201,628 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.