Patent Assignment
Reel/Frame 039086/0252
Assignment of Assignor's Interest
Recorded: 2016-07-06
Pages: 7
Assignors
CHEN, CHIA-YU
Executed: 2015-08-02
DORIS, BRUCE B.
Executed: 2015-08-03
HE, HONG
Executed: 2015-08-04
VENIGALLA, RAJASEKHAR
Executed: 2015-08-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Hybrid Substrate Engineering in Cmos Finfet Integration for Mobility Improvement