Patent Assignment
Reel/Frame 039138/0781
Assignment of Assignor's Interest
Recorded: 2016-07-12
Pages: 3
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2016-06-29
TSAI, JIUNYU
Executed: 2016-06-29
WANG, HUNG CHO
Executed: 2016-06-29
TU, TSUN CHUNG
Executed: 2016-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Manufacturing Mixed-Dimension and Void-Free Mram Structure