Patent Assignment
Reel/Frame 039167/0109
Assignment of Assignor's Interest
Recorded: 2016-07-15
Pages: 5
Assignors
LII, MIRNG-JI
Executed: 2015-10-01
LIU, CHUNG-SHI
Executed: 2015-10-01
KU, CHIN-YU
Executed: 2015-10-08
KUO, HUNG-JUI
Executed: 2015-10-01
KALNITSKY, ALEXANDER
Executed: 2015-10-06
HO, MING-CHE
Executed: 2015-10-01
WU, YI-WEN
Executed: 2015-10-01
CHEN, CHING-HUI
Executed: 2015-10-01
LIU, KIO-CHIO
Executed: 2016-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonding Structures and Methods Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 23, 2015
From: LII, MIRNG-JI; LIU, CHUNG-SHI; KU, CHIN-YU; KUO, HUNG-JUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036871/0569 →
Corrective Assignment to Correct the Typographical Error in the 9TH Inventor's Name Previously Recorded on Reel 039167 Frame 0109. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jun 4, 2018
From: LII, MIRNG-JI; LIU, CHUNG-SHI; KU, CHIN-YU; KUO, HUNG-JUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048582/0675 →