Patent Assignment
Reel/Frame 048582/0675
Corrective Assignment to Correct the Typographical Error in the 9TH Inventor's Name Previously Recorded on Reel 039167 Frame 0109. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Recorded: 2018-06-04
Pages: 9
Assignors
LII, MIRNG-JI
Executed: 2015-10-01
LIU, CHUNG-SHI
Executed: 2015-10-01
KU, CHIN-YU
Executed: 2015-10-08
KUO, HUNG-JUI
Executed: 2015-10-01
KALNITSKY, ALEXANDER
Executed: 2015-10-06
HO, MING-CHE
Executed: 2015-10-01
WU, YI-WEN
Executed: 2015-10-01
CHEN, CHING-HUI
Executed: 2015-10-01
LIU, KUO-CHIO
Executed: 2018-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Structures and Methods Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 23, 2015
From: LII, MIRNG-JI; LIU, CHUNG-SHI; KU, CHIN-YU; KUO, HUNG-JUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036871/0569 →
Assignment of Assignor's Interest
Jul 15, 2016
From: LII, MIRNG-JI; LIU, CHUNG-SHI; KU, CHIN-YU; KUO, HUNG-JUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 039167/0109 →