Patent Assignment
Reel/Frame 039173/0954
Assignment of Assignor's Interest
Recorded: 2016-07-17
Pages: 3
Assignors
KANG, DONG HEE
Executed: 2006-05-09
LEE, KYU WON
Executed: 2006-05-09
KIM, JAE YOON
Executed: 2006-05-09
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Including Premold and Method of Manufacturing the Same
Application:
15/202,245 →
Publication:
US 2016/0343593
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Jul 3, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 053549/0914 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →