Patent Assignment
Reel/Frame 039199/0525
Assignment of Assignor's Interest
Recorded: 2016-07-20
Pages: 8
Assignors
PARK, SEUNG-HO
Executed: 2016-03-25
JUNG, KI-HWA
Executed: 2016-03-25
KIM, SANG-KYUN
Executed: 2016-03-25
HWANG, JUN-HA
Executed: 2016-03-25
KWON, CHANG-GIL
Executed: 2016-03-25
BAEK, SEUNG-YEOP
Executed: 2016-04-06
LEE, JAE-WOO
Executed: 2016-03-25
LEE, JI-SUNG
Executed: 2016-04-07
CHOI, JAE-KWANG
Executed: 2016-06-15
HWANG, JIN-MYUNG
Executed: 2016-04-05
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
K.C. TECH CO., LTD
39, JE2GONGDAN 2-GIL, MIYANG-MYEON, ANSEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Compositions and Methods of Manufacturing Semiconductor Devices Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.