Patent Assignment
Reel/Frame 052865/0644
Change of Name
Recorded: 2020-06-08
Pages: 11
Assignor
K.C. TECH CO., LTD.
Executed: 2017-11-01
Assignee
KC CO., LTD.
39, JE2GONGDAN 2-GIL, MIYANG-MYEON, ANSEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(3)
Polishing Compositions and Methods of Manufacturing Semiconductor Devices Using the Same
Method of Fabricating Integrated Circuit Device by Using Slurry Composition
Slurry Composition for Chemical Mechanical Polishing
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2016
From: PARK, SEUNG-HO; JUNG, KI-HWA; KIM, SANG-KYUN; HWANG, JUN-HA
To: SAMSUNG ELECTRONICS CO., LTD.; K.C. TECH CO., LTD
Reel/Frame 039199/0525 →
Assignment of Assignor's Interest
Oct 7, 2016
From: LEE, JAE-HAK; CHOI, BO-HYEOK
To: K.C. TECH CO., LTD.
Reel/Frame 039965/0163 →
Assignment of Assignor's Interest
Oct 7, 2016
From: PARK, SANG-HYUN; KIM, SANG-KYUN; HUR, WON-KI
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 039965/0195 →
Assignment of Assignor's Interest
Feb 15, 2018
From: MOON, DOO-SIK; PARK, SANG-HYUN; YOON, BO-UN; KIM, HO-YOUNG
To: SAMSUNG ELECTRONICS CO., LTD.; K.C. TECH CO., LTD.
Reel/Frame 044940/0080 →
Assignment of Assignor's Interest
Jun 8, 2020
From: KC CO., LTD.
To: KCTECH CO., LTD.
Reel/Frame 052865/0744 →