IP Library › Assignment 039247/0889
Patent Assignment
Reel/Frame 039247/0889

Assignment of Assignor's Interest

Recorded: 2016-07-25 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-07-25
CARNEY, FRANCIS J.
Executed: 2016-07-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding
Patent: 9,852,972 →
Application: 15/218,848 →
Publication: US 2017/0084595
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →