Patent Assignment
Reel/Frame 039258/0559
Assignment of Assignor's Interest
Recorded: 2016-07-26
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2012-08-23
CHANG, CHIN-CHUAN
Executed: 2012-08-23
HUNG, JUI-PIN
Executed: 2012-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Package