Patent Assignment
Reel/Frame 039271/0486
Assignment of Assignor's Interest
Recorded: 2016-07-27
Pages: 6
Assignors
HATA, HIROKI
Executed: 2016-07-04
SHIGA, DAIKI
Executed: 2016-07-06
SUDA, TAKAHIRO
Executed: 2016-07-04
NISHIYAMA, YOSHIHIDE
Executed: 2016-07-04
Assignee
SUMITOMO METAL MINING CO., LTD.
11-3, SHIMBASHI 5-CHOME, MINATO-KU, TOKYO, 105-8716, JAPAN
Covered Property
(1)
Conductive Substrate, Conductive Substrate Laminate, Method for Producing Conductive Substrate, and Method for Producing Conductive Substrate Laminate