Patent Assignment
Reel/Frame 039272/0312
Assignment of Assignor's Interest
Recorded: 2016-07-27
Pages: 3
Assignor
KUO, CHIEN-LI
Executed: 2014-07-04
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.