Patent Assignment
Reel/Frame 039291/0816
Assignment of Assignor's Interest
Recorded: 2016-07-29
Pages: 4
Assignors
CHEN, FUCHENG
Executed: 2016-07-26
SHI, LINBO
Executed: 2016-07-26
LIU, YAO
Executed: 2016-07-26
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO. 18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Bonding Pad Structure, Bonding Ring Structure, and Mems Device Packaging Method