IP Library Assignment 039304/0521
Patent Assignment
Reel/Frame 039304/0521

Assignment of Assignor's Interest

Recorded: 2016-08-01 Pages: 3
Assignor
YANG, CHIH-CHAO
Executed: 2016-07-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method and Structure of Forming Low Resistance Interconnects
Patent: 9,875,966 →
Application: 15/225,003 →
Publication: US 2018/0033690
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052644/0868 →