Patent Assignment
Reel/Frame 039304/0807
Assignment of Assignor's Interest
Recorded: 2016-08-01
Pages: 2
Assignors
HSU, FENG-CHENG
Executed: 2016-07-19
CHEN, SHUO-MAO
Executed: 2016-07-19
HUNG, JUI-PIN
Executed: 2016-07-20
JENG, SHIN-PUU
Executed: 2016-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Passive Device Package and Methods of Forming Same