Assignment of Assignor's Interest

Recorded: 2016-08-01 Pages: 3

Assignors

HUEMOELLER, RONALD PATRICK

Executed: 2002-11-07

RUSLI, SUKIANTO

Executed: 2002-11-08

RAZU, DAVID

Executed: 2002-11-07

Assignee

AMKOR TECHNOLOGY, INC.

2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284

Covered Property (1)

Wafer Level Package and Fabrication Method

Patent: 9,871,015 →

Application: 15/225,284 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.