Patent Assignment
Reel/Frame 039338/0907
Assignment of Assignor's Interest
Recorded: 2016-07-14
Pages: 2
Assignors
LAGOUGE, MATTHIEU
Executed: 2016-07-12
ZHANG, QING
Executed: 2016-07-13
CHOUDHURI, MOHOMMAD
Executed: 2016-07-12
ZEB, GUL
Executed: 2016-07-13
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE, AUSTIN, TEXAS, 78735
Covered Property
(1)
Method of Integrating a Copper Plating Process in a Through-Substrate-Via (TSV) on CMOS Wafer
Patent:
9,704,784 →
Application:
15/209,964 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016.
Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →