Patent Assignment
Reel/Frame 039395/0734
Assignment of Assignor's Interest
Recorded: 2016-08-10
Pages: 5
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method and System for Packing Optimization of Semiconductor Devices
Application:
15/233,271 →
Publication:
US 2018/0047692
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.