Patent Assignment
Reel/Frame 039406/0373
Assignment of Assignor's Interest
Recorded: 2016-08-11
Pages: 8
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent:
6,495,442 →
Application:
09/691,497 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 18, 2000
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORP.
Reel/Frame 011236/0426 →
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Corrective Assignment to Correct the Full Assignee Name to: Megic Corporation Previously Recorded on Reel 011236 Frame 0426. Assignor(S) Hereby Confirms the Assignment from Mou-Shiung Lin; Jin-Yuan Lee to Megic Corporation.
Apr 29, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 038581/0367 →