Patent Assignment
Reel/Frame 038581/0367
Corrective Assignment to Correct the Full Assignee Name to: Megic Corporation Previously Recorded on Reel 011236 Frame 0426. Assignor(S) Hereby Confirms the Assignment from Mou-Shiung Lin; Jin-Yuan Lee to Megic Corporation.
Recorded: 2016-04-29
Pages: 7
Assignee
MEGIC CORPORATION
21 R & D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Properties
(2)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent:
6,495,442 →
Application:
09/691,497 →
Post Passivation Interconnection Schemes on Top of the Ic Chips
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 18, 2000
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORP.
Reel/Frame 011236/0426 →
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 030767/0836 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Corrective Assignment to Correct the Inside Assignment Document Previously Recorded at Reel: 038581 Frame: 0367. Assignor(S) Hereby Confirms the Assignment .
Jul 11, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039301/0260 →
Assignment of Assignor's Interest
Aug 11, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039406/0373 →
Assignment of Assignor's Interest
Sep 14, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039742/0740 →