Patent Assignment
Reel/Frame 039742/0740
Assignment of Assignor's Interest
Recorded: 2016-09-14
Pages: 8
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 030767/0836 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Corrective Assignment to Correct the Full Assignee Name to: Megic Corporation Previously Recorded on Reel 011236 Frame 0426. Assignor(S) Hereby Confirms the Assignment from Mou-Shiung Lin; Jin-Yuan Lee to Megic Corporation.
Apr 29, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 038581/0367 →
Corrective Assignment to Correct the Inside Assignment Document Previously Recorded at Reel: 038581 Frame: 0367. Assignor(S) Hereby Confirms the Assignment .
Jul 11, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039301/0260 →