Patent Assignment
Reel/Frame 030767/0836
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 3
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Corrective Assignment to Correct the Full Assignee Name to: Megic Corporation Previously Recorded on Reel 011236 Frame 0426. Assignor(S) Hereby Confirms the Assignment from Mou-Shiung Lin; Jin-Yuan Lee to Megic Corporation.
Apr 29, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 038581/0367 →
Corrective Assignment to Correct the Inside Assignment Document Previously Recorded at Reel: 038581 Frame: 0367. Assignor(S) Hereby Confirms the Assignment .
Jul 11, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039301/0260 →
Assignment of Assignor's Interest
Sep 14, 2016
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 039742/0740 →