Patent Assignment
Reel/Frame 039415/0286
Assignment of Assignor's Interest
Recorded: 2016-08-12
Pages: 8
Assignors
PANDEY, SUMEET C.
Executed: 2016-08-12
KRAUS, BRENDA D.
Executed: 2016-08-11
UHLENBROCK, STEFAN
Executed: 2016-08-11
SMYTHE, JOHN A.
Executed: 2016-08-11
QUICK, TIMOTHY A.
Executed: 2016-08-12
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming Silicon Nitride by Atomic Layer Deposition and Methods of Forming Semiconductor Structures
Patent:
9,865,456 →
Application:
15/235,365 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 2 to Patent Security Agreement
Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →