IP Library › Assignment 039434/0962
Patent Assignment
Reel/Frame 039434/0962

Assignment of Assignor's Interest

Recorded: 2016-08-15 Pages: 11
Assignors
UNG, LEE JAE
Executed: 2016-08-10
KIM, BYONG JIN
Executed: 2016-08-10
KIM, YOUNG SEOK
Executed: 2016-08-10
CHOI, WOOK
Executed: 2016-08-10
YOO, SEUNG JAE
Executed: 2016-08-10
LEE, YUNG WOO
Executed: 2016-08-10
CHO, EUNNARA
Executed: 2016-08-10
BANG, DONG HYUN
Executed: 2016-08-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Patent: 9,809,446 →
Application: 15/149,669 →
Publication: US 2017/0320723
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →