Patent Assignment
Reel/Frame 039452/0574
Assignment of Assignor's Interest
Recorded: 2016-08-16
Pages: 10
Assignors
IM, YUNHYEOK
Executed: 2016-04-14
FEYGENSON, OLEG
Executed: 2016-04-18
KIM, SANG IL
Executed: 2016-04-21
KIM, YOUNGBAE
Executed: 2016-04-20
KIM, JICHUL
Executed: 2016-04-20
MOK, SEUNGKON
Executed: 2016-04-20
HA, JUNGSU
Executed: 2016-04-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Packaged Semiconductor Chips Having Heat Dissipation Layers and Ground Contacts Therein