Patent Assignment
Reel/Frame 039456/0011
Assignment of Assignor's Interest
Recorded: 2016-08-16
Pages: 6
Assignors
SEO, SUN-KYOUNG
Executed: 2016-06-30
RYU, SEUNG-KWAN
Executed: 2016-06-30
JO, CHA-JEA
Executed: 2016-06-30
CHO, TAE-JE
Executed: 2016-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Semiconductor Package Including the Same, and Method of Manufacturing Semiconductor Chip