Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
The semiconductor chip including a semiconductor device layer including a pad region and a cell region, a plurality of uppermost wirings formed on the semiconductor device layer to be arranged at an equal distance in the cell region, a passivation layer formed in the cell region and the pad region, and a plurality of thermal bumps disposed on the passivation layer to be electrically insulated from the plurality of uppermost wirings may be provided. The semiconductor device layer may include a plurality of through silicon via (TSV) structures in the pad region. The plurality of uppermost wirings may extend in parallel along one direction and have a same width. The passivation layer may cover at least a top surface of the plurality of uppermost wirings in the cell region and includes a top surface having a wave shape.
1. A semiconductor chip comprising:
a semiconductor device layer including a pad region and a cell region, the semiconductor device layer including a plurality of through silicon via (TSV) structures in the pad region;
a plurality of uppermost wirings on the semiconductor device layer, the plurality of uppermost wirings arranged at an equal distance in the cell region, the plurality of uppermost wirings having a same width and extending in parallel along one direction;
a passivation layer in the cell region and the pad region, the passivation layer covering at least a top surface of the plurality of uppermost wirings in the cell region, the top surface of the passivation layer in the cell region having a wave shape; and
a plurality of thermal bumps on the passivation layer, the plurality of thermal bumps electrically insulated from the plurality of uppermost wirings.
2. The semiconductor chip of claim 1 , further comprising:
a plurality of pads on the semiconductor device layer, the plurality of pads connected to the plurality of TSV structures in the pad region; and
a plurality of signal bumps on the plurality of pads, the plurality of signal bumps electrically connected to the plurality of pads.
3. The semiconductor chip of claim 2 , wherein
the passivation layer further covers a top surface of the plurality of uppermost wirings in the pad region, and includes a bump hole exposing a portion of a top surface of each of the plurality of pads, and
each of the plurality of signal bumps is connected to a respective one of the plurality of pads through the bump hole.
4. The semiconductor chip of claim 2 , wherein an upper end of each of the plurality of signal bumps and an upper end of each of the plurality of thermal bumps have a same level.
5. The semiconductor chip of claim 2 , wherein the plurality of signal bumps and the plurality of thermal bumps have a same horizontal width.
6. The semiconductor chip of claim 2 , wherein
the plurality of signal bumps are arranged at a first pitch, and
the plurality of thermal bumps are arranged at a second pitch greater the first pitch.
7. The semiconductor chip of claim 1 , wherein the passivation layer comprises an inorganic insulating material.
8. The semiconductor chip of claim 1 , wherein at least two adjacent upper wirings of the plurality of uppermost wirings are electrically connected to each other to function as one wiring.
9. The semiconductor chip of claim 8 , wherein at least a portion of each of the at least two adjacent uppermost wirings extends under at least one of the plurality of thermal bumps.
10. The semiconductor chip of claim 8 , wherein the at least two adjacent uppermost wirings are configured to transfer at least one of a power signal or a ground signal.
11. The semiconductor chip of claim 1 , wherein a step height of the top surface of the passivation layer in the cell region is 100 nm or less.
12. The semiconductor chip of claim 10 , wherein a width of each of the plurality of uppermost wirings in the cell region is 200 nm to 500 nm.
13. The semiconductor chip of claim 1 , wherein a bottom surface of each of the plurality of thermal bumps has a wave shape corresponding to the top surface of the passivation layer.
14. A semiconductor chip including a pad region and a cell region, the semiconductor chip comprising:
a plurality of through silicon via (TSV) structures in the pad region;
a plurality of uppermost wirings in the cell region, the plurality of uppermost wirings forming part of circuit configurations of the semiconductor chip, adjacent ones of the plurality of uppermost wirings being spaced apart by a same distance, each of the plurality of uppermost wirings having a same width, the plurality of uppermost wirings extending in parallel along one direction;
a passivation layer in the cell region and the pad region, the passivation layer covering at least a top surface of the plurality of uppermost wirings in the cell region, a top surface of the passivation layer in the cell region having a wave shape; and
a plurality of thermal bumps on the passivation layer, the plurality of thermal bumps electrically insulated from the plurality of uppermost wirings.
15. The semiconductor chip of claim 14 , wherein the plurality of uppermost wirings do not include redistribution wirings, which are provided to make available at least some of the plurality of pads in other locations.
16. The semiconductor chip of claim 14 , further comprising:
a plurality of pads on the semiconductor device layer in the pad region, the plurality of pads connected to the plurality of TSV structures in the pad region; and
a plurality of signal bumps on the plurality of pads, the plurality of signal bumps electrically connected to the plurality of pads.
17. The semiconductor chip of claim 16 , wherein an upper end of each of the plurality of signal bumps and an upper end of each of the plurality of thermal bumps have a same level.
18. The semiconductor chip of claim 14 , wherein
the passivation layer further covers a top surface of the plurality of uppermost wirings in the pad region, and includes a bump hole exposing a portion of a top surface of each of the plurality of pads, and
each of the plurality of signal bumps is connected to a respective one of the plurality of pads through the bump hole.
19. The semiconductor chip of claim 14 , wherein at least two adjacent upper wirings of the plurality of uppermost wirings are electrically connected to each other to function as one wiring.
20. The semiconductor chip of claim 19 , wherein at least a portion of each of the at least two adjacent uppermost wirings extends under at least one of the plurality of thermal bumps.