Patent Assignment
Reel/Frame 039468/0078
Assignment of Assignor's Interest
Recorded: 2016-08-17
Pages: 4
Assignors
HSU, FENG-CHENG
Executed: 2016-08-02
HUNG, JUI-PIN
Executed: 2016-08-09
JENG, SHIN-PUU
Executed: 2016-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of the Same