Patent Assignment
Reel/Frame 039477/0519
Assignment of Assignor's Interest
Recorded: 2016-08-18
Pages: 6
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-01
NOMA, TAKASHI
Executed: 2016-08-08
SAITO, KAZUHIRO
Executed: 2016-08-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →