IP Library › Assignment 039482/0967
Patent Assignment
Reel/Frame 039482/0967

Assignment of Assignor's Interest

Recorded: 2016-07-26 Pages: 4
Assignors
ARAI, TETSUYA
Executed: 2016-07-26
TSUKADA, SHUICHI
Executed: 2016-07-26
TANIGUCHI, JUNKI
Executed: 2016-07-26
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property (1)
Semiconductor Device Including Buffer Circuit
Application: 15/220,310 →
Publication: US 2017/0353183
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 2 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →