Patent Assignment
Reel/Frame 039514/0940
Assignment of Assignor's Interest
Recorded: 2016-07-29
Pages: 7
Assignors
RYU, JI YEON
Executed: 2016-07-15
KIM, BYONG JIN
Executed: 2016-07-15
SHIM, JAE BEUM
Executed: 2016-07-15
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Having an Etched Groove for an Embedded Device Formed on Bottom Surface of a Support Substrate and a Method for Fabricating the Same
Application:
15/149,436 →
Publication:
US 2017/0194239
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.