IP Library Assignment 039544/0847
Patent Assignment
Reel/Frame 039544/0847

Assignment of Assignor's Interest

Recorded: 2016-08-25 Pages: 3
Assignors
HABA, BELGACEM
Executed: 2016-08-25
SITARAM, ARKALGUD R.
Executed: 2016-08-25
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Ultrathin layer for forming a capacitive interface between joined Integrated Circuit Components
Application: 15/247,705 →
Publication: US 2017/0092620
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →