IP Library › Assignment 039549/0288
Patent Assignment
Reel/Frame 039549/0288

Assignment of Assignor's Interest

Recorded: 2016-08-26 Pages: 3
Assignor
KEIO UNIVERSITY
Executed: 2016-06-07
Assignee
THRUCHIP JAPAN, INC.
1-11 KANDA OGAWAMACHI, CHIYODA-KU, TOKYO, 101-0052, JAPAN
Covered Properties (5)
Inductor Element, Integrated Circuit Device, and Three-Dimensional Circuit Device
Patent: 8,704,627 →
Application: 12/992,466 →
Publication: US 2011/0090036
Semiconductor Device and Manufacturing Method Therefor
Patent: 8,564,093 →
Application: 13/058,423 →
Publication: US 2011/0133309
Inductor Element and Integrated Circuit Device
Patent: 8,872,609 →
Application: 13/203,403 →
Publication: US 2011/0309907
Sealed Semiconductor Recording Medium and Sealed Semiconductor Memory
Patent: 8,827,166 →
Application: 13/377,677 →
Publication: US 2012/0091211
Multi-Stack Semiconductor Integrated Circuit Device
Patent: 8,744,349 →
Application: 13/501,879 →
Publication: US 2012/0217658
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 10, 2010
From: KURODA, TADAHIRO
To: KEIO UNIVERSITY
Reel/Frame 025491/0549 →
Assignment of Assignor's Interest Feb 16, 2011
From: KURODA, TADAHIRO
To: KEIO UNIVERSITY
Reel/Frame 025817/0040 →
Assignment of Assignor's Interest Aug 31, 2011
From: KURODA, TADAHIRO
To: KEIO UNIVERSITY
Reel/Frame 026837/0089 →
Assignment of Assignor's Interest Dec 13, 2011
From: KURODA, TADAHIRO
To: KEIO UNIVERSITY
Reel/Frame 027372/0629 →
Assignment of Assignor's Interest May 11, 2012
From: KURODA, TADAHIRO
To: KEIO UNIVERSITY
Reel/Frame 028194/0788 →