Patent Assignment
Reel/Frame 039553/0190
Assignment of Assignor's Interest
Recorded: 2016-08-26
Pages: 6
Assignors
SHIM, IL KWON
Executed: 2013-12-20
KIM, KYUNG MOON
Executed: 2013-12-23
CHI, HEEJO
Executed: 2013-12-23
KOO, JUNMO
Executed: 2013-12-20
LIAO, BARTHOLOMEW
Executed: 2013-12-20
CAMACHO, ZIGMUND RAMIREZ
Executed: 2013-12-20
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Under Bump Metallization and Method of Manufacture Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.