IP Library › Assignment 039854/0080
Patent Assignment
Reel/Frame 039854/0080

Change of Name

Recorded: 2016-08-29 Pages: 4
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Integrated Circuit Packaging System with Under Bump Metallization and Method of Manufacture Thereof
Patent: 9,865,554 →
Application: 14/955,033 →
Publication: US 2016/0099222
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 26, 2016
From: SHIM, IL KWON; KIM, KYUNG MOON; CHI, HEEJO; KOO, JUNMO
To: STATS CHIPPAC LTD.
Reel/Frame 039553/0190 →
Assignment of Assignor's Interest Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →