IP Library Assignment 039569/0488
Patent Assignment
Reel/Frame 039569/0488

Assignment of Assignor's Interest

Recorded: 2016-08-29 Pages: 3
Assignors
NELSON, DONALD W.
Executed: 2014-06-16
WEBB, M CLAIR
Executed: 2014-08-05
MORROW, PATRICK
Executed: 2014-06-16
JUN, KIMIN
Executed: 2014-06-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Silicon Die with Integrated High Voltage Devices
Application: 15/122,382 →
Publication: US 2017/0069597
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 1, 2016
From: NELSON, DONALD W.; WEBB, M CLAIR; MORROW, PATRICK; JUN, KIMIN
To: INTEL CORPORATION
Reel/Frame 039614/0950 →