Patent Assignment
Reel/Frame 039600/0766
Assignment of Assignor's Interest
Recorded: 2016-08-31
Pages: 4
Assignors
CUI, JI
Executed: 2016-08-30
LAM, VIET
Executed: 2016-08-30
GRUMBINE, STEVEN
Executed: 2016-08-26
Assignee
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property
(1)
Methods and Compositions for Processing Dielectric Substrate
Application:
15/252,567 →
Publication:
US 2017/0066944
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →