IP Library Assignment 039690/0155
Patent Assignment
Reel/Frame 039690/0155

Assignment of Assignor's Interest

Recorded: 2016-09-09 Pages: 8
Assignors
USHIDA, TAKURO
Executed: 2016-08-18
KAMAKURA, TSUKASA
Executed: 2016-08-29
HIROSE, YOSHIRO
Executed: 2016-08-18
NAKATANI, KIMIHIKO
Executed: 2016-08-18
Assignee
HITACHI KOKUSAI ELECTRIC INC
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Recording Medium
Patent: 9,953,830 →
Application: 15/124,915 →
Publication: US 2017/0018419
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →