IP Library Granted Patent US 9,953,830
Granted Patent B2
US 9,953,830 · App. 15/124,915 · Granted Apr 24, 2018

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

Inventors: Takuro Ushida (Toyama, JP); Tsukasa Kamakura (Toyama, JP); Yoshiro Hirose (Toyama, JP); Kimihiko Nakatani (Toyama, JP)
Assignee: Hitachi Kokusai Electric Inc.
H01L21/0228C23C16/405C23C16/45527C23C16/45534C23C16/52H01L21/02186H01L21/02277
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Quick Facts
Patent No.
US 9,953,830
App. No.
15/124,915
Granted
Apr 24, 2018
Kind
B2
Abstract

A method of manufacturing a semiconductor device includes forming an oxide film containing a metal element on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing: supplying a precursor containing a metal element and a halogen group to the substrate; and supplying an oxidant to the substrate. In the act of supplying the oxidant, a catalyst is supplied to the substrate together with the oxidant. In the act of supplying the precursor, the catalyst is not supplied to the substrate.

Claims (27)

1. A method of manufacturing a semiconductor device, comprising:

forming an oxide film containing a metal element on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:

supplying a precursor containing the metal element and a halogen group to the substrate; and

supplying an oxidant to the substrate,

wherein in the act of supplying the oxidant, a catalyst is supplied to the substrate together with the oxidant, and in the act of supplying the precursor, the catalyst is not supplied to the substrate.

2. The method of claim 1 , wherein the precursor is nitrogen-free.

3. The method of claim 1 , wherein the precursor is carbon-free.

4. The method of claim 1 , wherein the precursor is carbon- and nitrogen-free.

5. The method of claim 1 , wherein the precursor is an amino-group-free.

6. The method of claim 1 , wherein the halogen group includes a chloro group, a fluoro group, a bromo group or an iodine group.

7. The method of claim 1 , wherein the halogen group includes a chloro group.

8. The method of claim 1 , wherein the metal element includes a transition metal or a typical metal.

9. The method of claim 1 , wherein the metal element includes a transition metal.

10. The method of claim 1 , wherein the precursor includes a metal halide.

11. A substrate processing apparatus, comprising:

a process chamber configured to accommodate a substrate;

a precursor supply system configured to supply a precursor containing a metal element and a halogen group to the substrate accommodated in the process chamber;

an oxidant supply system configured to supply an oxidant to the substrate accommodated in the process chamber;

a catalyst supply system configured to supply a catalyst to the substrate accommodated in the process chamber; and

a control part configured to control the precursor supply system, the oxidant supply system and the catalyst supply system so as to perform forming an oxide film containing the metal element on the substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:

supplying the precursor to the substrate accommodated in the process chamber; and

supplying the oxidant to the substrate accommodated in the process chamber,

wherein in the act of supplying the oxidant, the catalyst is supplied to the substrate together with the oxidant, and in the act of supplying the precursor, the catalyst is not supplied to the substrate.

12. A non-transitory computer-readable recording medium storing a program that causes a computer to perform forming an oxide film containing a metal element on a substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing:

supplying a precursor containing the metal element and a halogen group to the substrate accommodated in a process chamber; and

supplying an oxidant to the substrate accommodated in the process chamber

wherein in the act of supplying the oxidant, a catalyst is supplied to the substrate together with the oxidant, and in the act of supplying the precursor, the catalyst is not supplied to the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2016
From: USHIDA, TAKURO; KAMAKURA, TSUKASA; HIROSE, YOSHIRO; NAKATANI, KIMIHIKO
To: HITACHI KOKUSAI ELECTRIC INC
Reel/Frame 039690/0155 →
Continuity (1)
Related Publication 20170018419A1 · Jan 19, 2017