Patent Assignment
Reel/Frame 039822/0522
Assignment of Assignor's Interest
Recorded: 2016-09-22
Pages: 3
Assignor
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2016-09-02
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property
(1)
Substrate, Chip Package and Method for Manufacturing Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 1, 2014
From: SU, WEI-SHUO
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033440/0858 →
Assignment of Assignor's Interest
Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →