IP Library › Assignment 039822/0539
Patent Assignment
Reel/Frame 039822/0539

Assignment of Assignor's Interest

Recorded: 2016-09-22 Pages: 4
Assignors
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2016-09-02
Assignees
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Package on Package Structure and Method for Manufacturing Same
Patent: 9,000,573 →
Application: 14/477,888 →
Publication: US 2014/0374894
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 8, 2014
From: CHEN, CHIEN-CHIH; SHI, HONG-XIA; HSU, SHIH-PING
To: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO.,LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 033693/0798 →
Assignment of Assignor's Interest Sep 14, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 064899/0050 →