Patent Assignment
Reel/Frame 039879/0777
Assignment of Assignor's Interest
Recorded: 2016-09-28
Pages: 5
Assignee
QORVO US, INC.
7628 THORNDIKE ROAD, GREENSBORO, NORTH CAROLINA, 27409
Covered Property
(1)
Using an Interconnect Bump to Traverse Through a Passivation Layer of a Semiconductor Die
Application:
15/278,960 →
Publication:
US 2017/0018520